Epoxycyclohexylethyl Terminated Polydimethylsiloxane
Epoxycyclohexylethyl Terminated Polydimethylsiloxane is a dual-terminated alicyclic epoxy-modified silicone fluid with flexible polydimethylsiloxane backbone and reactive 2-(3,4-epoxycyclohexyl)ethyl groups at both molecular terminals, categorized as a reactive epoxy siloxane。 Custom viscosity specifications are available upon customer request.
Epoxycyclohexylethyl Terminated Polydimethylsiloxane
Epoxycyclohexylethyl Terminated Polydimethylsiloxane
CAS No.: 102782-98-9
Epoxy Equivalent Weight: 300–600 g/eq
Density (25℃): 0.98–1.00 g/cm³
Refractive Index: 1.410–1.415
Flash Point: Above 150℃, low volatility
Epoxycyclohexylethyl Terminated Polydimethylsiloxane is a dual-terminated alicyclic epoxy-modified silicone fluid with flexible polydimethylsiloxane backbone and reactive 2-(3,4-epoxycyclohexyl)ethyl groups at both molecular terminals, categorized as a reactive epoxy siloxane。
Storage Requirements
Store in tightly sealed containers away from light at 2–25℃, keep away from sunlight and UV light sources.
Do not store together with amines or strong acids to avoid premature ring-opening polymerization of epoxy groups.
Keep packaging airtight to prevent moisture and dust intrusion; standard shelf life ranges from 6 to 12 months.
Keep away from high-temperature heat sources and open flames, managed as general fine chemicals.
Viscosity (25℃): 25–35 cSt
Custom viscosity specifications are available upon customer request.
UV cationic weather-resistant coatings: Topcoat films for optical films, plastics and metals to enhance smooth abrasion resistance and long-term UV anti-yellowing performance.
Optoelectronic packaging materials: LED encapsulants, optical lens adhesives and insulating potting compounds for electronic components with low internal stress and high light transmittance.
Cationic photosensitive resins for SLA 3D printing: Toughening modifier to reduce product brittleness and improve dimensional stability.
Nanoimprint photoresists: Low viscosity and fast crosslinking performance suitable for high-precision microfabrication.
Modifier for epoxy resins: Improves epoxy toughness, reduces curing internal stress and boosts substrate adhesion.
Migration-free reactive release agents: For optical films and precision molds without silicone contamination.
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