Poly(4-methylstyrene)
Poly(4-methylstyrene) is a hydrophobic high-molecular polymer synthesized via addition polymerization from the monomer 4-methylstyrene (p-methylstyrene)。 Custom molecular weights are available upon request.
Poly(4-methylstyrene)
I. Basic Physical & Chemical Properties
Basic Identification
Full Name: Poly(4-methylstyrene)
Abbreviation: P4MS / P(p-methylstyrene)
CAS No.: 24936-41-2
Repeat Unit Formula: [CH2CH(C6H4CH3)]n
Appearance
Industrial and reagent grades are white or milky white solid pellets or powder, odorless. Particle size and melt flow vary with molecular weight.
Structural & Core Characteristics
It has saturated carbon backbone with para-methylbenzene side chains, a non-polar aromatic polyolefin. It features excellent chemical inertness with strong resistance to acids, alkalis and most organic solvents. Higher molecular rigidity and thermal stability than general polystyrene.
Solubility
Soluble in aromatic and halogenated solvents such as toluene, xylene, chloroform and THF; Insoluble in water, alcohols, acetone, alkanes and esters.
Thermal Properties
Glass transition temperature (Tg): 110~118℃; thermal decomposition temperature above 380℃, superior thermal stability to common polystyrene.
II. Storage, Handling & Safety Instructions
Storage: Keep tightly sealed away from light, store dry at ambient temperature, keep away from heat sources and strong oxidants. Safety: Dust may form during handling; wear dust-proof masks. Avoid prolonged skin contact. Slightly irritant, not for oral intake. Dispose of waste as ordinary polymer solid waste.
III. Hazardous Goods Labeling
Hazard Classification: Ordinary polymer solid, non-dangerous goods (Non-DG) Hazard Statements: No standard GHS hazard statements; dust inhalation may cause slight respiratory irritation. Precautionary Statements: Operate under well-ventilated conditions to avoid excessive dust generation; flush eyes with clean water if contacted. Transport Classification: General chemical without dangerous goods declaration requirement.
| Molecular Weight | Purity |
| Mw:~660kDa | 96% |
Custom molecular weights are available upon request.
1. Photoresin raw material: Substrate for semiconductor photoresist with high transparency and etching resistance, key material for advanced microelectronics lithography.
2. Polymer modification: Blended with rubber and polyolefin to improve heat resistance, rigidity and chemical resistance.
3. Chromatographic stationary phase matrix: Aromatic skeleton suitable for separation of non-polar organic compounds.
4. Special engineering plastics: Heat-resistant transparent parts, optical accessories and corrosion-resistant precision components.
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